Tag: tribe_events
FEA
Events
Calendar of Events
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The session outlines updates in Ansys Mechanical and Ansys Discovery under the 2026 R1 release, focusing on improving structural simulation workflows. It aims to highlight advancements in meshing, automation, and performance to support efficient problem-solving without compromising accuracy. Join the webinar to explore: AI-driven model setup using geometry recognition Simplified meshing with automated sizing controls […] |
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This beginner-friendly workshop aims to introduce engineering and physics students to Computational Fluid Dynamics (CFD) using Ansys Fluent, industry-leading software used by aerospace and automotive companies. Attendees will walk through the complete CFD pipeline, covering pre-processing, meshing, physics setup (defining inlet velocities, pressures, and fluid properties), solver execution, and post-processing including interpreting contours, streamlines, and […] |
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This webinar explores simulation-driven approaches for centrifugal pump design and reliability assessment. It aims to demonstrate how integrated structural simulation workflows can help identify potential failure modes such as blade stress, seal thermal overload, resonance and fatigue risks before physical prototyping. The session also covers predictive maintenance strategies, digital twin enablement, vibration analysis and the […] |
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This session provides an overview of the simulation workflow in COMSOL Multiphysics®, introducing participants to the key stages involved in creating and analyzing multiphysics models. This 1-day event aims to cover the software interface, geometry creation, material selection, physics setup, meshing, solver configuration, and result visualization. The event is designed for beginners seeking to understand […] |
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The webinar Efficient Preprocessing of Complex Electronics Assemblies Using Ansys Stacker Meshing will discuss the Stacker Meshing workflow in Ansys Mechanical for handling layered 2.5D geometries used in electronics assemblies such as PCBs, BGAs and semiconductor packages. The session aims to explain how layer-based meshing can capture thickness and material variations while reducing dependence on […] |
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