Webinar: Efficient Preprocessing of Complex Electronics Assemblies Using Ansys Stacker Meshing

This webinar will discuss the Stacker Meshing workflow in Ansys Mechanical for handling layered 2.5D geometries used in electronics assemblies such as PCBs, BGAs and semiconductor packages. The session aims to explain how layer-based meshing can capture thickness and material variations while reducing dependence on full 3D geometry. It will also cover applications in thermal, structural and multiphysics simulations across electronics and other layered engineering structures.

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