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Tag: tribe_events
35 events found.
CFD and Thermal
Events
Calendar of Events
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The webinar Thermal Simulation of Atmospheric Re-entry from Low-Earth Orbit with TAITherm/MuSES and CoTherm examines spacecraft heating challenges during return from orbit. Using an Inflatable Atmospheric Decelerator case study, the webinar aims to demonstrate a 20-minute descent simulation across hypersonic and supersonic phases. Topics include transient heating, automated workflows, heat flux prediction, surface temperatures, and […]
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This webinar explores the simulation of biochemical sensors and diagnostic devices in COMSOL Multiphysics®. It focuses on mechanisms within bioreceptors and transducers, such as: Electrochemical, optical, and acoustic transducers Protein adsorption and enzyme kinetics The session aims to demonstrate how multiphysics modeling can be used to study mass transport and chemical reactions in the design […] |
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This webinar focuses on approaches to developing useful simulation models using MATLAB and Simulink, addressing challenges in balancing effort and accuracy. It aims to cover different modeling methods, from prebuilt models to custom equations, and discusses integrating real-world and test data for parameter estimation. The session also outlines techniques for model validation, optimization, and applying […] |
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This beginner-friendly workshop aims to introduce engineering and physics students to Computational Fluid Dynamics (CFD) using Ansys Fluent, industry-leading software used by aerospace and automotive companies. Attendees will walk through the complete CFD pipeline, covering pre-processing, meshing, physics setup (defining inlet velocities, pressures, and fluid properties), solver execution, and post-processing including interpreting contours, streamlines, and […] |
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This webinar focuses on equation-based modeling in COMSOL Multiphysics, outlining how users can define and solve custom equations within a multiphysics framework. It aims to cover integrating user-defined PDEs with built-in physics interfaces such as structural mechanics, electromagnetics, and heat transfer, while also presenting formulation approaches through examples like convection–diffusion. For registration click here.. |
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This session explores lithium-ion battery thermal runaway through combined experimental studies and CFD simulations. It examines gas generation, venting, and thermal behavior across different cell types, comparing results to validate modeling approaches. Attendees will gain insight into representing internal reactions and ejection processes, supporting early-stage development of predictive thermal runaway models. For registration click here.. |
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This webinar explores simulation-driven approaches for centrifugal pump design and reliability assessment. It aims to demonstrate how integrated structural simulation workflows can help identify potential failure modes such as blade stress, seal thermal overload, resonance and fatigue risks before physical prototyping. The session also covers predictive maintenance strategies, digital twin enablement, vibration analysis and the […]
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This webinar examines how AI data centers are increasingly being designed and operated as industrial-scale AI factories, where infrastructure, silicon, power, cooling, and workloads need to function as an integrated system. The session aims to explore continuous performance optimization strategies, the growing importance of “tokens per watt” as a key operational metric, and the role […] |
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This webinar will examine how automation can be applied to cabin comfort simulation workflows in TAITherm and CoTherm. The session aims to demonstrate methods for reducing repetitive manual set-up and post-processing tasks through tools such as Human Thermal Clothing Manager (HTCM), Thermal Comfort Analysis Tool (TCAT), journals, and automated thermal reporting, while outlining approaches for […] |
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The webinar Efficient Preprocessing of Complex Electronics Assemblies Using Ansys Stacker Meshing will discuss the Stacker Meshing workflow in Ansys Mechanical for handling layered 2.5D geometries used in electronics assemblies such as PCBs, BGAs and semiconductor packages. The session aims to explain how layer-based meshing can capture thickness and material variations while reducing dependence on […] |
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