Webinar by Moldex3D
Event Type
Webinar
Location
Europe, Asia Pasific
Event - Date
November 26, 2025
Timing
10:00 AM CET / 2:30 PM IST
Language
English
Moldex3D has developed two key strategies — the Hybrid Model and the Equivalent Bump Group (EBG) Model — to enhance efficiency and accelerate Capillary Underfill (CUF) simulation. These methods not only ensure accuracy but also significantly reduce computation time.
In this webinar, the speaker will give a fundamental introduction to Hybrid CUF and Hybrid EBG CUF. Several practical simulation cases will be presented to help attendees gain a comprehensive understanding of their benefits. A step-by-step demonstration of Hybrid EBG CUF operation in Moldex3D will be provided.
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