Moldex3D Webinar: Accelerating Capillary Underfill Simulation with Hybrid EBG CUF in Moldex3D

Moldex3D has developed two key strategies — the Hybrid Model and the Equivalent Bump Group (EBG) Model — to enhance efficiency and accelerate Capillary Underfill (CUF) simulation. These methods not only ensure accuracy but also significantly reduce computation time.

In this webinar, the speaker will give a fundamental introduction to Hybrid CUF and Hybrid EBG CUF. Several practical simulation cases will be presented to help attendees gain a comprehensive understanding of their benefits. A step-by-step demonstration of Hybrid EBG CUF operation in Moldex3D will be provided.

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