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DTSTART;TZID=Asia/Kolkata:20251211T213000
DTEND;TZID=Asia/Kolkata:20251211T213000
DTSTAMP:20260508T022948
CREATED:20251209T135923Z
LAST-MODIFIED:20251217T144637Z
UID:18195-1765488600-1765488600@simulationpulse.com
SUMMARY:Ansys Webinar: CFD & Digital Twin of Clean Rooms
DESCRIPTION:Contamination Control with ISO 14644\nThe ISO 14644-4:2022 claims that “the amount of air required for a particular cleanroom is not dependent on the volume of the room\, but rather on the nature of the activities within the room and the design of the air distribution system” and suggests that “Computational fluid dynamics (CFD) is a suitable tool for [..] predicting the effectiveness of different cleanroom designs”. \nThis webinar will review some limitations of the ACH evaluation and explain how AI and engineering simulation could nicely COMPLEMENT traditional methods. The suitability and validation of computational models by using the ASME VVUQ40 will be explained before unveiling the promise of clean rooms digital twin. \n 
URL:https://simulationpulse.com/event/ansys-webinar-cfd-digital-twin-of-clean-rooms/
ATTACH;FMTTYPE=image/jpeg:https://simulationpulse.com/wp-content/uploads/2025/12/P2-1.jpg
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DTSTART;TZID=Asia/Kolkata:20251217T053000
DTEND;TZID=Asia/Kolkata:20251217T083000
DTSTAMP:20260508T022948
CREATED:20251215T152454Z
LAST-MODIFIED:20251217T145651Z
UID:18368-1765949400-1765960200@simulationpulse.com
SUMMARY:Ansys Webinar: Accelerating ESD Simulation for Full-Chip and Multi-Die 3D-IC Design
DESCRIPTION:Join the PathFinder-SC webinar to learn about early pre-LVS ESD checks\, cloud-native designs\, and layout-based debugging to accelerate signoff and enhance design reliability. \nWhat Attendees Will Learn: \n\nCell-based modeling of clamps from GDS/OASIS and/or P&R tool DEF/LEF\nOverview of static ESD simulation checks handled by PathFinder-SC for fullchip\, interposer and multi-die designs\nPerformance overview and future road map sharing\nDebug and diagnostic capabilities
URL:https://simulationpulse.com/event/ansys-webinar-accelerating-esd-simulation-for-full-chip-and-multi-die-3d-ic-design/
ATTACH;FMTTYPE=image/jpeg:https://simulationpulse.com/wp-content/uploads/2025/12/P4.jpg
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DTSTART;TZID=Asia/Kolkata:20251218T150000
DTEND;TZID=Asia/Kolkata:20251218T160000
DTSTAMP:20260508T022948
CREATED:20251217T183943Z
LAST-MODIFIED:20251217T183943Z
UID:18379-1766070000-1766073600@simulationpulse.com
SUMMARY:COMSOL Webinar: Modeling and Simulation of MEMS Devices
DESCRIPTION:As the demand for MEMS components continues to grow in applications such as smartphones\, vehicles\, navigation systems\, and healthcare monitoring\, engineers must account for complex microscale interactions between electrostatic\, mechanical\, piezoelectric\, and electrothermal effects\, as well as fluid–structure interaction. Achieving accurate representations of these interactions requires multiphysics simulation and an integrated platform to speed up the product development cycle. \nJoin this live webinar to learn how the COMSOL Multiphysics software can be used to model MEMS devices. The webinar will show the built-in features and functionality available in the software through example models. The webinar will include an introduction to the software’s capabilities and a few demonstrations.
URL:https://simulationpulse.com/event/comsol-webinar-modeling-and-simulation-of-mems-devices/
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