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SUMMARY:Ansys webinar: Scaling and Optimizing Data Center Cooling
DESCRIPTION:This webinar explores a “chip-to-rack” approach to thermal management in AI data centers\, covering the shift from air to liquid cooling. It aims to cover direct-to-chip\, cold plate\, immersion\, and two-phase cooling methods\, along with multiphysics simulation tools such as Ansys Icepak\, Fluent\, Thermal Desktop\, RedHawk-SC ET\, and TwinBuilder. Real-world applications involving AI GPUs\, liquid-cooled servers\, and high-power busbars will also be discussed. \nFor registration click here..
URL:https://simulationpulse.com/event/ansys-webinar-scaling-and-optimizing-data-center-cooling/
ATTACH;FMTTYPE=image/jpeg:https://simulationpulse.com/wp-content/uploads/2026/09/10-1.jpg
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