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UID:20291-1772742600-1772749800@simulationpulse.com
SUMMARY:Mathworks Webinar: Physical Modeling in Simulink and Introduction to Simscape
DESCRIPTION:Join the webinar to explore physical modeling techniques in Simulink and the foundational capabilities of Simscape for multi-domain system simulation. The session outlines modeling workflows for mechanical\, thermal\, and electrical systems\, along with strategies for integrating physical models into control design and system-level analysis. Practical demonstrations highlight simulation\, verification\, and performance evaluation approaches. \nFor registration click here..
URL:https://simulationpulse.com/event/mathworks-webinar-physical-modeling-in-simulink-and-introduction-to-simscape/
ATTACH;FMTTYPE=image/jpeg:https://simulationpulse.com/wp-content/uploads/2026/02/Mathworks.jpg
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DTSTART;TZID=America/Los_Angeles:20260311T080000
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UID:20697-1773216000-1773334800@simulationpulse.com
SUMMARY:Synopsys Converge Conference: Re-engineering the Future
DESCRIPTION:Synopsys Converge 2026 is a premier technology conference bringing together industry leaders\, engineers\, and innovators to explore the future of semiconductor design\, AI-driven engineering\, and advanced systems development. The event features keynote sessions\, technical talks\, and live demonstrations on topics such as chip design\, electronic design automation\, simulation technologies\, and intelligent system innovation\, providing a platform for collaboration\, learning\, and showcasing next-generation engineering solutions.\nFor registration click here..
URL:https://simulationpulse.com/event/synopsys-converge-conference-re-engineering-the-future/
LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, California (CA)\, 95054\, United States
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UID:20897-1773842400-1773847800@simulationpulse.com
SUMMARY:NAFEMS webinar: A Surrogate Modeling Framework
DESCRIPTION:Surrogate Modeling Framework for Fast Thermal–Mechanical Reliability Analysis of Discrete Power Packages \nAn online technical session by NAFEMS explores approaches for improving reliability assessment in discrete power electronic packages. Miniaturization and increasing power density often lead to thermal stresses that can cause fatigue in solder joints during repeated thermal cycling. The discussion aims to examine how traditional finite element simulations\, while accurate\, can be computationally intensive and slow for early design stages. A surrogate modeling framework is presented that combines finite element–based virtual design of experiments\, sensitivity analysis\, and regression techniques to approximate simulation results and enable faster evaluation of key design parameters affecting thermal resistance and fatigue life. \nFor registration click here..
URL:https://simulationpulse.com/event/nafems-webinar-a-surrogate-modeling-framework/
ATTACH;FMTTYPE=image/jpeg:https://simulationpulse.com/wp-content/uploads/2026/03/66.jpg
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