BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//The Simulation Pulse - ECPv6.15.20//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://simulationpulse.com
X-WR-CALDESC:Events for The Simulation Pulse
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:Asia/Kolkata
BEGIN:STANDARD
TZOFFSETFROM:+0530
TZOFFSETTO:+0530
TZNAME:IST
DTSTART:20240101T000000
END:STANDARD
END:VTIMEZONE
BEGIN:VTIMEZONE
TZID:Asia/Manila
BEGIN:STANDARD
TZOFFSETFROM:+0800
TZOFFSETTO:+0800
TZNAME:PST
DTSTART:20240101T000000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;TZID=Asia/Kolkata:20251217T053000
DTEND;TZID=Asia/Kolkata:20251217T083000
DTSTAMP:20260508T022901
CREATED:20251215T152454Z
LAST-MODIFIED:20251217T145651Z
UID:18368-1765949400-1765960200@simulationpulse.com
SUMMARY:Ansys Webinar: Accelerating ESD Simulation for Full-Chip and Multi-Die 3D-IC Design
DESCRIPTION:Join the PathFinder-SC webinar to learn about early pre-LVS ESD checks\, cloud-native designs\, and layout-based debugging to accelerate signoff and enhance design reliability. \nWhat Attendees Will Learn: \n\nCell-based modeling of clamps from GDS/OASIS and/or P&R tool DEF/LEF\nOverview of static ESD simulation checks handled by PathFinder-SC for fullchip\, interposer and multi-die designs\nPerformance overview and future road map sharing\nDebug and diagnostic capabilities
URL:https://simulationpulse.com/event/ansys-webinar-accelerating-esd-simulation-for-full-chip-and-multi-die-3d-ic-design/
ATTACH;FMTTYPE=image/jpeg:https://simulationpulse.com/wp-content/uploads/2025/12/P4.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Kolkata:20251218T150000
DTEND;TZID=Asia/Kolkata:20251218T160000
DTSTAMP:20260508T022901
CREATED:20251217T183943Z
LAST-MODIFIED:20251217T183943Z
UID:18379-1766070000-1766073600@simulationpulse.com
SUMMARY:COMSOL Webinar: Modeling and Simulation of MEMS Devices
DESCRIPTION:As the demand for MEMS components continues to grow in applications such as smartphones\, vehicles\, navigation systems\, and healthcare monitoring\, engineers must account for complex microscale interactions between electrostatic\, mechanical\, piezoelectric\, and electrothermal effects\, as well as fluid–structure interaction. Achieving accurate representations of these interactions requires multiphysics simulation and an integrated platform to speed up the product development cycle. \nJoin this live webinar to learn how the COMSOL Multiphysics software can be used to model MEMS devices. The webinar will show the built-in features and functionality available in the software through example models. The webinar will include an introduction to the software’s capabilities and a few demonstrations.
URL:https://simulationpulse.com/event/comsol-webinar-modeling-and-simulation-of-mems-devices/
ATTACH;FMTTYPE=image/jpeg:https://simulationpulse.com/wp-content/uploads/2025/12/P6.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Manila:20251225T090000
DTEND;TZID=Asia/Manila:20251226T170000
DTSTAMP:20260508T022901
CREATED:20251222T104008Z
LAST-MODIFIED:20251222T104112Z
UID:18399-1766653200-1766768400@simulationpulse.com
SUMMARY:International Conference on Simulation Modeling\, Electronic Information Science and Technology
DESCRIPTION:The conference by ASAR (Association for Scientific and Academic Research) will be held in physical and virtual mode\, bringing together global experts\, researchers\, and professionals with a shared mission—to disseminate groundbreaking research and strengthen the global community in this critical field. \nFor registration click here..
URL:https://simulationpulse.com/event/international-conference-on-simulation-modeling-electronic-information-science-and-technology/
LOCATION:Manila Hotel\, Bonifacio Dr\, Ermita\,Manila\, 0913 Metro Manila\, Philippines\, Manila\, Philippines
ATTACH;FMTTYPE=image/jpeg:https://simulationpulse.com/wp-content/uploads/2025/12/P3-1.jpg
END:VEVENT
END:VCALENDAR