BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//The Simulation Pulse - ECPv6.17.2//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-WR-CALNAME:The Simulation Pulse
X-ORIGINAL-URL:https://simulationpulse.com
X-WR-CALDESC:Events for The Simulation Pulse
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:Asia/Kolkata
BEGIN:STANDARD
TZOFFSETFROM:+0530
TZOFFSETTO:+0530
TZNAME:IST
DTSTART:20250101T000000
END:STANDARD
END:VTIMEZONE
BEGIN:VTIMEZONE
TZID:Europe/Berlin
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:20250330T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CET
DTSTART:20251026T010000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:20260329T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CET
DTSTART:20261025T010000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:20270328T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CET
DTSTART:20271031T010000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;TZID=Asia/Kolkata:20260812T080000
DTEND;TZID=Asia/Kolkata:20260812T180000
DTSTAMP:20260729T202800Z
CREATED:20260729T202800Z
LAST-MODIFIED:20260729T202800Z
UID:26025-1786521600-1786557600@simulationpulse.com
SUMMARY:Cadence Live India 2026
DESCRIPTION:CadenceLIVE India brings together semiconductor and systems design professionals to explore developments in electronic design automation\, simulation\, and AI-driven chip design. The agenda spans multiple technical tracks\, including digital and analog design\, verification\, IP integration\, chiplets\, advanced packaging\, and system design and analysis\, alongside physical AI\, digital twin\, and simulation-driven applications. The event aims to feature customer case studies and technology updates. \nFor registration click here..
URL:https://simulationpulse.com/event/cadence-live-india-2026/
LOCATION:Sheraton Grand Bengaluru Whitefield Hotel & Convention Center
ATTACH;FMTTYPE=image/jpeg:https://simulationpulse.com/wp-content/uploads/2026/07/5.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Berlin:20260818T140000
DTEND;TZID=Europe/Berlin:20260818T143000
DTSTAMP:20260811T085141Z
CREATED:20260811T085141Z
LAST-MODIFIED:20260811T085141Z
UID:26624-1787061600-1787063400@simulationpulse.com
SUMMARY:Webinar: Thermomechanical Modeling with COMSOL® in 18 Minutes
DESCRIPTION:This webinar aims to explore how thermal expansion\, phase change\, and thermal creep contribute to thermal stress and how these thermomechanical effects can be modeled using COMSOL Multiphysics® software. It covers model examples and case studies\, along with a live demonstration followed by Q&A session. \nFor registration click here..
URL:https://simulationpulse.com/event/webinar-thermomechanical-modeling-with-comsol-in-18-minutes/
ATTACH;FMTTYPE=image/jpeg:https://simulationpulse.com/wp-content/uploads/2026/08/1-2.jpg
END:VEVENT
END:VCALENDAR