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DTSTART:20240101T000000
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DTSTART;TZID=Asia/Kolkata:20251217T053000
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SUMMARY:Ansys Webinar: Accelerating ESD Simulation for Full-Chip and Multi-Die 3D-IC Design
DESCRIPTION:Join the PathFinder-SC webinar to learn about early pre-LVS ESD checks\, cloud-native designs\, and layout-based debugging to accelerate signoff and enhance design reliability. \nWhat Attendees Will Learn: \n\nCell-based modeling of clamps from GDS/OASIS and/or P&R tool DEF/LEF\nOverview of static ESD simulation checks handled by PathFinder-SC for fullchip\, interposer and multi-die designs\nPerformance overview and future road map sharing\nDebug and diagnostic capabilities
URL:https://simulationpulse.com/event/ansys-webinar-accelerating-esd-simulation-for-full-chip-and-multi-die-3d-ic-design/
ATTACH;FMTTYPE=image/jpeg:https://simulationpulse.com/wp-content/uploads/2025/12/P4.jpg
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