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UID:27097-1788357600-1788363000@simulationpulse.com
SUMMARY:NAFEMS webinar: Engineering Simulation Market Analysis & Trends
DESCRIPTION:This NAFEMS webinar aims to examine the rapidly evolving convergence of EDA\, MCAE\, and AI\, exploring the industry forces behind this shift\, including major EDA vendors acquiring leading CAE software companies. It aims to discuss why this trend is occurring\, its strategic implications for engineering organizations and software vendors\, how AI is being used\, and potential implications for engineering simulation\, multidisciplinary product development\, and digital engineering. \nFor registration click here..
URL:https://simulationpulse.com/event/nafems-webinar-engineering-simulation-market-analysis-trends/
ATTACH;FMTTYPE=image/jpeg:https://simulationpulse.com/wp-content/uploads/2026/08/6.jpg
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DTSTART;TZID=Asia/Kolkata:20260903T173000
DTEND;TZID=Asia/Kolkata:20260903T183000
DTSTAMP:20260827T181443Z
CREATED:20260827T181443Z
LAST-MODIFIED:20260827T181443Z
UID:27344-1788456600-1788460200@simulationpulse.com
SUMMARY:AVL webinar: Battery Cell Design
DESCRIPTION:This session aims to examine how battery cell teardown analysis\, AI-driven image processing\, and simulation can be used to characterize electrode microstructures and identify design features beyond visual inspection. It explores how these structural characteristics relate to cell performance and how simulation can assess design trade-offs\, while considering how data-driven insights support battery development\, testing\, and engineering decisions. \nFor registration click here..
URL:https://simulationpulse.com/event/avl-webinar-battery-cell-design/
ATTACH;FMTTYPE=image/jpeg:https://simulationpulse.com/wp-content/uploads/2026/08/2-3.jpg
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DTSTART;TZID=America/New_York:20260922T110000
DTEND;TZID=America/New_York:20260922T120000
DTSTAMP:20260917T093719Z
CREATED:20260917T093719Z
LAST-MODIFIED:20260917T093719Z
UID:28149-1790074800-1790078400@simulationpulse.com
SUMMARY:Ansys webinar: Scaling and Optimizing Data Center Cooling
DESCRIPTION:This webinar explores a “chip-to-rack” approach to thermal management in AI data centers\, covering the shift from air to liquid cooling. It aims to cover direct-to-chip\, cold plate\, immersion\, and two-phase cooling methods\, along with multiphysics simulation tools such as Ansys Icepak\, Fluent\, Thermal Desktop\, RedHawk-SC ET\, and TwinBuilder. Real-world applications involving AI GPUs\, liquid-cooled servers\, and high-power busbars will also be discussed. \nFor registration click here..
URL:https://simulationpulse.com/event/ansys-webinar-scaling-and-optimizing-data-center-cooling/
ATTACH;FMTTYPE=image/jpeg:https://simulationpulse.com/wp-content/uploads/2026/09/10-1.jpg
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