NAFEMS webinar: A Surrogate Modeling Framework

Surrogate Modeling Framework for Fast Thermal–Mechanical Reliability Analysis of Discrete Power Packages

An online technical session by NAFEMS explores approaches for improving reliability assessment in discrete power electronic packages. Miniaturization and increasing power density often lead to thermal stresses that can cause fatigue in solder joints during repeated thermal cycling. The discussion aims to examine how traditional finite element simulations, while accurate, can be computationally intensive and slow for early design stages. A surrogate modeling framework is presented that combines finite element–based virtual design of experiments, sensitivity analysis, and regression techniques to approximate simulation results and enable faster evaluation of key design parameters affecting thermal resistance and fatigue life.

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