As electronic devices become smaller and more power-dense, managing heat has become important for reliability, electrical performance, signal integrity and mechanical integrity. EDRMedeso highlights Ansys Icepak, a CFD-based thermal simulation tool that aims to analyse conduction, convection and radiation across chip, package, PCB and system levels. It supports ECAD and power-dissipation data, steady-state and transient analysis, and cooling components such as heat sinks and fans.
Integrated with Ansys Electronics Desktop, Icepak can couple thermal analysis with HFSS, Maxwell, Q3D Extractor and SIwave, link with Ansys Mechanical and Sherlock for reliability, and connect with Ansys Discovery for early-stage exploration. Overall, the approach aims to make thermal analysis an integrated part of electronics design and validation.
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