Ansys webinar: Scaling and Optimizing Data Center Cooling

This webinar explores a “chip-to-rack” approach to thermal management in AI data centers, covering the shift from air to liquid cooling. It aims to cover direct-to-chip, cold plate, immersion, and two-phase cooling methods, along with multiphysics simulation tools such as Ansys Icepak, Fluent, Thermal Desktop, RedHawk-SC ET, and TwinBuilder. Real-world applications involving AI GPUs, liquid-cooled servers, and high-power busbars will also be discussed.

For registration click here..