Webinar: Surrogate Thermal Models using Ansys Icepak

As semiconductor designs shift to heterogeneous 3D-IC architectures, securely sharing accurate thermal models has become critical. This webinar aims to explore how Ansys Icepak’s Boundary Condition-independent Surrogate Thermal Models convert detailed 3D CFD simulations into encrypted, system-level models, enabling reliable thermal prediction, streamlined collaboration, and IP protection across diverse operating environments.

For registration click here..